Recently, a delegation of experts from POSTECH Nine Lab visited Sanchuang Technology Co., Ltd. for an inspection tour. Both parties engaged in technical exchanges and cooperation discussions across fields including AI big data hybrid solvers, chip thermal-hydraulic numerical analysis, and advanced liquid cooling solutions, jointly exploring collaborative innovation pathways for high-end chip simulation and thermal management.
As a cutting-edge laboratory specializing in artificial intelligence, big data, and high-performance numerical computation, Nine Lab has long been dedicated to developing AI-driven hybrid solvers. It is currently advancing a chip thermal-fluid multiphysics coupling numerical analysis project, providing high-precision simulation and performance optimization support for advanced computing, semiconductor packaging, and high-density computing scenarios. As a provider of liquid cooling and thermal management solutions, Sanchuang Technology emerged as the core collaboration partner during Nine Lab's visit, leveraging its mature liquid cooling module design, flow field thermal control integration, and engineering capabilities.
Mr. Huang Hailun, Chairman of Sanchuang Technology Co., Ltd., delivered a keynote address. On behalf of the company, Chairman Huang first extended warm congratulations to all award recipients and teams for the year 2025. He also expressed sincere gratitude to every Sanchuang employee who remained steadfast in their posts, fulfilled their duties diligently, and demonstrated dedication and hard work throughout the past year. He comprehensively reviewed the company's development journey in 2025, conducted an in-depth analysis of achievements and lessons learned across all operations, and objectively assessed current industry trends alongside the opportunities and challenges facing the company, thereby charting the course for the new year.
The Nine Lab representative stated that the laboratory leverages AI and hybrid solver technologies to achieve rapid, high-precision solutions for complex thermal-hydraulic fields. It urgently requires stable, efficient liquid cooling hardware solutions to support simulation implementation and engineering validation. Sanchuang Technology's liquid cooling modules align with project requirements in terms of heat dissipation efficiency, spatial integration, and reliability, laying a solid foundation for future joint R&D.
The head of Sanchuang Technology welcomed the Nine Lab team's visit, noting that as AI large models and advanced chips evolve toward higher computing power and integration, thermal management has become a core bottleneck for performance breakthroughs. The company will leverage this exchange to capitalize on its strengths in customized, modular, and scalable liquid cooling solutions. It will collaborate with Nine Lab on joint technical validation, solution optimization, and commercialization, supporting high-end chip numerical simulation and performance enhancement with mature liquid cooling technologies to advance Sino-Korean industry-academia-research innovation.
This exchange has established a stable cooperative bridge between Sanchuang Technology and Korea's premier AI laboratory. Moving forward, both parties will deepen collaboration in areas such as chip thermal-hydraulic numerical analysis and the synergistic optimization of AI solvers with liquid cooling hardware. This will drive the deep integration of cutting-edge simulation technology with advanced thermal management solutions, providing more efficient and reliable technical support for the semiconductor and artificial intelligence industries.
